Intel Malaysia
Building an RM12 billion advanced packaging complex in Penang, with first-phase assembly and test due in 2026.
Profile
- Country
- Penang, Malaysia
- Type
- Semiconductor & electronics
- Website
- intel.com
- Subsystems
Public profile
Compiled by MEIHA from public sources. Not verified with the company.
Last reviewed 7 Oct 2026
Sources
- CRN Asia, Intel Malaysian packaging complex, 2026. crnasia.com